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“For the A21 iPhone SoCs, Apple will use Intel's advanced 14A node, which promises a generational leap in density, frequency, and power savings. Apple's primary goal is to employ a more advanced node for mobile devices, with plans to have these chips ready by 2028. As this is anticipated to begin in about two years, Apple will likely wait for the final 14A PDK before starting trial production. It remains uncertain whether the company will manufacture its A21 Pro SoC at TSMC and leave the regular version to Intel. However, Apple is gradually diversifying its supply chain with more silicon manufacturers. With advanced packaging, Intel can compete with TSMC in many areas, and we are eager to see the outcomes of this competition.
Finally, Apple's solutions might require some packaging techniques to meet the expected performance of the M7 SoC. This could involve a combination of the Foveros family, including Foveros-S, R, B, or Foveros Direct, paired with EMIB. These options offer interposers and RDL options, along with true 3D stacking using Cu-to-Cu hybrid bonding, for scenarios that demand extreme die-to-die bandwidth or power efficiency. Additionally, small silicon EMIB bridges are available in variants like EMIB-M, with embedded MIM capacitors, and EMIB-T, with TSVs.”
Source: https://www.techpowerup.com/349020/...-node-for-m7-macbook-chip-14a-node-for-iphone
Finally, Apple's solutions might require some packaging techniques to meet the expected performance of the M7 SoC. This could involve a combination of the Foveros family, including Foveros-S, R, B, or Foveros Direct, paired with EMIB. These options offer interposers and RDL options, along with true 3D stacking using Cu-to-Cu hybrid bonding, for scenarios that demand extreme die-to-die bandwidth or power efficiency. Additionally, small silicon EMIB bridges are available in variants like EMIB-M, with embedded MIM capacitors, and EMIB-T, with TSVs.”
Source: https://www.techpowerup.com/349020/...-node-for-m7-macbook-chip-14a-node-for-iphone